It is a removal process where certain particles are bound to an adsorbent particle surface by either chemical or physical attraction.

On Earth various chemical- and flame-associated powdering processes are adopted in part to prevent serious degradation of particle surfaces by atmospheric oxygen.

Moreover, grinding also creates crystallographic defects at and below the particle surface.

Then, when the particles were inside the range of the strong force, they increased the energy gradient at the particle surfaces sufficiently to initiate pair production.

It leaves a thin glassy coating that helps bind the silica to particle surfaces.

The dielectric is then formed over all the tantalum particle surfaces by the electrochemical process of anodization.

With grafted polymers, the backbone of the polymer chain is covalently bonded to the particle surface.

In a few microencapsulation processes, the direct polymerization of a single monomer is carried out on the particle surface.

As a result, position of the particle surface becomes uncertain.

It is ultimately caused by the presence of a charged interface between the particle surface and the surrounding fluid.