Those same innovations could one day be used to replace copper interconnects in electronic systems.

It was fabricated in a 90 nm process with copper interconnects and SOI.

In general, grain boundary diffusion is the major electromigration process in aluminum wires, whereas surface diffusion is dominant in copper interconnects.

The EV68C was fabricated in a 0.18 m CMOS process with copper interconnects.

It was to be fabricated in a 0.18 micrometre CMOS process with copper interconnects.

Although its codename gives the impression that it used copper interconnects, its interconnects were in fact aluminium.

It is manufactured using a 0.13 μm process with copper interconnects, low-K dielectric, and silicon on insulator technology.

AMD's new fab in Dresden came online, allowing further production increases, and the process technology was improved by a switch to copper interconnects.

The standard defines several classes of twisted-pair copper interconnects, which differ in the maximum frequency for which a certain channel performance is required:

You may also have noted that there is a movement towards copper interconnects replacing the aluminum ones.